{"title":"泡沫高速电缆的经验模型","authors":"Xin Wu, Feng Ling","doi":"10.1109/EMCSI.2018.8495335","DOIUrl":null,"url":null,"abstract":"As the foaming technology becoming widely adopted for high-speed cable, the challenge of modeling the generic foaming which is a combination of skin and foam structure becomes critical for both cable design and channel analysis. An empirical model is proposed and validation with measurements are presented in this paper for targeted applications.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An Empirical Model for Foamed High-speed Cable\",\"authors\":\"Xin Wu, Feng Ling\",\"doi\":\"10.1109/EMCSI.2018.8495335\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the foaming technology becoming widely adopted for high-speed cable, the challenge of modeling the generic foaming which is a combination of skin and foam structure becomes critical for both cable design and channel analysis. An empirical model is proposed and validation with measurements are presented in this paper for targeted applications.\",\"PeriodicalId\":120342,\"journal\":{\"name\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCSI.2018.8495335\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCSI.2018.8495335","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
As the foaming technology becoming widely adopted for high-speed cable, the challenge of modeling the generic foaming which is a combination of skin and foam structure becomes critical for both cable design and channel analysis. An empirical model is proposed and validation with measurements are presented in this paper for targeted applications.