{"title":"利用高速视频分析进行缺陷调查和工艺改进","authors":"Adam Chalupa, Eric Ritschdorff","doi":"10.1109/ASMC.2019.8791795","DOIUrl":null,"url":null,"abstract":"We demonstrate the application of high-speed video analysis to Wet Etch and Cleans process and equipment improvements in a high-volume semiconductor manufacturing environment. Through high-temporal-resolution video usage, a method of analysis was developed for systematic defect reduction, yield improvement, and cost reduction efforts. Three case studies are presented showing utility of high-speed video analysis that led to defect origin isolation from faulty equipment, chemical usage reduction saving almost 30% in costs per year, and high-speed capture to analyze flow-controller dependent flow stabilizations.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"97 7","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Using High-Speed Video Analysis for Defect Investigation and Process Improvement\",\"authors\":\"Adam Chalupa, Eric Ritschdorff\",\"doi\":\"10.1109/ASMC.2019.8791795\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrate the application of high-speed video analysis to Wet Etch and Cleans process and equipment improvements in a high-volume semiconductor manufacturing environment. Through high-temporal-resolution video usage, a method of analysis was developed for systematic defect reduction, yield improvement, and cost reduction efforts. Three case studies are presented showing utility of high-speed video analysis that led to defect origin isolation from faulty equipment, chemical usage reduction saving almost 30% in costs per year, and high-speed capture to analyze flow-controller dependent flow stabilizations.\",\"PeriodicalId\":287541,\"journal\":{\"name\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"97 7\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2019.8791795\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791795","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Using High-Speed Video Analysis for Defect Investigation and Process Improvement
We demonstrate the application of high-speed video analysis to Wet Etch and Cleans process and equipment improvements in a high-volume semiconductor manufacturing environment. Through high-temporal-resolution video usage, a method of analysis was developed for systematic defect reduction, yield improvement, and cost reduction efforts. Three case studies are presented showing utility of high-speed video analysis that led to defect origin isolation from faulty equipment, chemical usage reduction saving almost 30% in costs per year, and high-speed capture to analyze flow-controller dependent flow stabilizations.