当前可集成传感器技术概述

38th IAS Annual Meeting on Conference Record of the Industry Applications Conference, 2003. Pub Date : 2003-10-12 DOI:10.1109/IAS.2003.1257710

Chucheng Xiao, Lingyin Zhao, T. Asada, W. Odendaal, J. D. van Wyk

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引用次数: 206

摘要

概述了当前适合封装到集成电力电子模块和集成无源电源处理单元中的传感技术，如集成分流和可集成Rogowski线圈技术。本文考虑的技术包括:集成电流分流器、电流互感器、Rogowski线圈、霍尔效应电流传感器、巨磁阻传感器(GMR)和磁阻传感器(MI)。每一种当前的传感技术分别讨论了它们的优点，局限性和设计权衡。特别强调的特点是增强或限制技术的潜力被集成到包装过程中。

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An overview of integratable current sensor technologies

An overview is given of current sensing technologies that are suitable for packaging into integrated power electronics modules and integrated passive power processing units, such as integrated shunts and integratable Rogowski coils technologies. Technologies considered in this paper include: integrated current shunts, current transformers, Rogowski coils, Hall-effect current sensors, giant magneto resistive sensors (GMR) and magneto impedance sensors (MI). Each of these current sensing technologies is discussed separately along with their advantages, limitations and design trade-offs. Special emphasis is given to features that enhance or limit the technology's potential for being integrated in the packaging process.

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38th IAS Annual Meeting on Conference Record of the Industry Applications Conference, 2003.

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