结合电铸和CFRP应用的射频无源器件创新制造技术

S. Liberatoscioli, M. Mattes, M. Guglielmi, D. Schmitt, C. Ernst
{"title":"结合电铸和CFRP应用的射频无源器件创新制造技术","authors":"S. Liberatoscioli, M. Mattes, M. Guglielmi, D. Schmitt, C. Ernst","doi":"10.1109/MWSYM.2008.4632939","DOIUrl":null,"url":null,"abstract":"In this paper an innovative manufacturing technology is presented that combines electroforming and CFRP (Carbon Fiber Reinforced Plastic) application and thus could be an enabling technology to achieve tuningless lightweight RF passive hardware with complex geometries. In order to demonstrate the performances achievable with this manufacturing process, a highly sensitive 0.14% fractional bandwidth dual mode filter centered at 19.8GHz was fabricated and tested. The flange interface of the filter was an integral part of the hardware and the total weight four times lighter than an equivalent part made from INVAR.","PeriodicalId":273767,"journal":{"name":"2008 IEEE MTT-S International Microwave Symposium Digest","volume":"10 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Innovative manufacturing technology for RF Passive devices combining electroforming and CFRP application\",\"authors\":\"S. Liberatoscioli, M. Mattes, M. Guglielmi, D. Schmitt, C. Ernst\",\"doi\":\"10.1109/MWSYM.2008.4632939\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper an innovative manufacturing technology is presented that combines electroforming and CFRP (Carbon Fiber Reinforced Plastic) application and thus could be an enabling technology to achieve tuningless lightweight RF passive hardware with complex geometries. In order to demonstrate the performances achievable with this manufacturing process, a highly sensitive 0.14% fractional bandwidth dual mode filter centered at 19.8GHz was fabricated and tested. The flange interface of the filter was an integral part of the hardware and the total weight four times lighter than an equivalent part made from INVAR.\",\"PeriodicalId\":273767,\"journal\":{\"name\":\"2008 IEEE MTT-S International Microwave Symposium Digest\",\"volume\":\"10 5\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-06-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE MTT-S International Microwave Symposium Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2008.4632939\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE MTT-S International Microwave Symposium Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2008.4632939","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文提出了一种结合电铸和CFRP(碳纤维增强塑料)应用的创新制造技术,从而可以实现具有复杂几何形状的无调谐轻量级射频无源硬件。为了证明这种制造工艺可以实现的性能,制作并测试了一个高灵敏度0.14%分数带宽的双模滤波器,中心为19.8GHz。过滤器的法兰接口是硬件的一个组成部分,总重量比由INVAR制造的等效部件轻四倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Innovative manufacturing technology for RF Passive devices combining electroforming and CFRP application
In this paper an innovative manufacturing technology is presented that combines electroforming and CFRP (Carbon Fiber Reinforced Plastic) application and thus could be an enabling technology to achieve tuningless lightweight RF passive hardware with complex geometries. In order to demonstrate the performances achievable with this manufacturing process, a highly sensitive 0.14% fractional bandwidth dual mode filter centered at 19.8GHz was fabricated and tested. The flange interface of the filter was an integral part of the hardware and the total weight four times lighter than an equivalent part made from INVAR.
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