相邻电路之间耦合的评估

J. Osburn
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引用次数: 0

摘要

分析相邻电路之间的耦合首先要评估电路源和负载之间所有内部和外部电缆配置的线对线耦合。在相同和相邻的印刷电路板上的电路的附加辐射耦合模型被开发和评估。总耦合是来自两个源的干扰信号的总和。给出了分析实例并进行了讨论。对可能使用这种更深入的分析的条件的描述结束了讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of Coupling Between Adjacent Circuits
Analysis of coupling between adjacent circuits begins with evaluation of wire—to—wire coupling for all internal and external cable configurations between sources and loads of circuits. Models for additional radiated coupling from circuits on the same and adjacent printed circuits boards is developed and evaluated. Total coupling is the summation of interference signals from both sources. Analytical examples are presented and discussed. A description of the conditions when this more-in-depth analysis might be used closes the discussion.
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