聚醚醚酮(PEEK)与各种导电填料的力学和电学性能

C. Extrand
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引用次数: 3

摘要

导电或静态耗散配方的聚醚酮(PEEK)广泛应用于微电子工业中,需要优异的温度,化学和耐磨性(Campbell和Tan, 1997)。先前关于PEEK用于电子处理应用的工作集中在碳(C)纤维化合物的污染方面(Mikkelsen, 1996)。本研究比较了含有多种导电填料(碳纤维、碳粉和不锈钢纤维)的PEEK化合物的机械和电气性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mechanical and electrical properties of poly(ether ether ketone) (PEEK) with various conductive fillers
Conductive or static dissipative formulations of poly(etheretherketone) (PEEK) are used widely in the microelectronics industry where excellent temperature, chemical, and abrasion resistance are required (Campbell and Tan, 1997). Previous work on PEEK for electronics handling applications has focused on the contamination aspects of carbon (C) fiber compounds (Mikkelsen, 1996). This study compares the mechanical and electrical properties of PEEK compounds that contain a variety of conductive fillers: carbon fiber, carbon powder, and stainless steel fiber.
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