{"title":"脉动热管CPU散热器传热性能实验研究","authors":"F. Shang, Qingjing Yang, Jianhong Liu","doi":"10.1115/mnhmt2019-4017","DOIUrl":null,"url":null,"abstract":"\n According to the characteristics of heat dissipation process and the structural characteristics of traditional heat dissipation device, pulsating heat pipe (PHP) and traditional The pin-finned heat sink are used to simulate the cooling process of CPU, so as to meet the cooling requirements of computer CPU. By comparing the heat transfer perform of the two heat sinks under three conditions: the top wall temperature of the heat sink, the wall temperature of the heat sink and the temperature difference between the inlet and outlet of hot water, it can be found that the heat transfer performance of the PHP radiator is better. The experimental results show that in order to further improve the heat dissipation performance of the computer CPU, the CPU radiator device can be manufactured by the PHP device, and the PHP technology has broad application prospects in electronic heat dissipation.","PeriodicalId":331854,"journal":{"name":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","volume":"13 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Experimental Study on Heat Transfer Performance of Pulsating Heat Pipe CPU Radiator\",\"authors\":\"F. Shang, Qingjing Yang, Jianhong Liu\",\"doi\":\"10.1115/mnhmt2019-4017\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n According to the characteristics of heat dissipation process and the structural characteristics of traditional heat dissipation device, pulsating heat pipe (PHP) and traditional The pin-finned heat sink are used to simulate the cooling process of CPU, so as to meet the cooling requirements of computer CPU. By comparing the heat transfer perform of the two heat sinks under three conditions: the top wall temperature of the heat sink, the wall temperature of the heat sink and the temperature difference between the inlet and outlet of hot water, it can be found that the heat transfer performance of the PHP radiator is better. The experimental results show that in order to further improve the heat dissipation performance of the computer CPU, the CPU radiator device can be manufactured by the PHP device, and the PHP technology has broad application prospects in electronic heat dissipation.\",\"PeriodicalId\":331854,\"journal\":{\"name\":\"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer\",\"volume\":\"13 3\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/mnhmt2019-4017\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/mnhmt2019-4017","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Experimental Study on Heat Transfer Performance of Pulsating Heat Pipe CPU Radiator
According to the characteristics of heat dissipation process and the structural characteristics of traditional heat dissipation device, pulsating heat pipe (PHP) and traditional The pin-finned heat sink are used to simulate the cooling process of CPU, so as to meet the cooling requirements of computer CPU. By comparing the heat transfer perform of the two heat sinks under three conditions: the top wall temperature of the heat sink, the wall temperature of the heat sink and the temperature difference between the inlet and outlet of hot water, it can be found that the heat transfer performance of the PHP radiator is better. The experimental results show that in order to further improve the heat dissipation performance of the computer CPU, the CPU radiator device can be manufactured by the PHP device, and the PHP technology has broad application prospects in electronic heat dissipation.