Anju Singh, S. Vaishnavi, Ajay Andhiwal, A. V. Nirmal
{"title":"用于航空航天的微型低压差混合式稳压器新工艺","authors":"Anju Singh, S. Vaishnavi, Ajay Andhiwal, A. V. Nirmal","doi":"10.1109/GCAT52182.2021.9587887","DOIUrl":null,"url":null,"abstract":"Low Dropout Regulators (LDO) are extensively used in power conditioning and distribution systems that need a low noise & stable voltage supplies independent of load, input voltage variations, temperature, and time. This article details the development of thick film technology-based miniature LDO hybrid providing excellent electrical performance with required thermal management attained by implementing high thermal conductive GlidCop base metal package & Copper cored pin materials for applications in space power systems. Advance attachment materials used at various segments of hybrid i.e., silicon die component to substrate, substrate to package and heat sink interface material for isometric heat transfer, are also highlighted. Hybrid realization of LDO faced various challenges as traditional packaging approach results in instable performance with extremely unmanageable thermal deals. Fabrication challenges and issues faced while designing functional & Burn-in test jigs are also addressed. Glidcop package qualification and hybrid realization process qualification details have also been presented in this article.","PeriodicalId":436231,"journal":{"name":"2021 2nd Global Conference for Advancement in Technology (GCAT)","volume":"178 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel Process for Miniature Low Dropout Voltage Regulator Hybrid for Aerospace Applications\",\"authors\":\"Anju Singh, S. Vaishnavi, Ajay Andhiwal, A. V. Nirmal\",\"doi\":\"10.1109/GCAT52182.2021.9587887\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Low Dropout Regulators (LDO) are extensively used in power conditioning and distribution systems that need a low noise & stable voltage supplies independent of load, input voltage variations, temperature, and time. This article details the development of thick film technology-based miniature LDO hybrid providing excellent electrical performance with required thermal management attained by implementing high thermal conductive GlidCop base metal package & Copper cored pin materials for applications in space power systems. Advance attachment materials used at various segments of hybrid i.e., silicon die component to substrate, substrate to package and heat sink interface material for isometric heat transfer, are also highlighted. Hybrid realization of LDO faced various challenges as traditional packaging approach results in instable performance with extremely unmanageable thermal deals. Fabrication challenges and issues faced while designing functional & Burn-in test jigs are also addressed. Glidcop package qualification and hybrid realization process qualification details have also been presented in this article.\",\"PeriodicalId\":436231,\"journal\":{\"name\":\"2021 2nd Global Conference for Advancement in Technology (GCAT)\",\"volume\":\"178 5\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 2nd Global Conference for Advancement in Technology (GCAT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GCAT52182.2021.9587887\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 2nd Global Conference for Advancement in Technology (GCAT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GCAT52182.2021.9587887","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel Process for Miniature Low Dropout Voltage Regulator Hybrid for Aerospace Applications
Low Dropout Regulators (LDO) are extensively used in power conditioning and distribution systems that need a low noise & stable voltage supplies independent of load, input voltage variations, temperature, and time. This article details the development of thick film technology-based miniature LDO hybrid providing excellent electrical performance with required thermal management attained by implementing high thermal conductive GlidCop base metal package & Copper cored pin materials for applications in space power systems. Advance attachment materials used at various segments of hybrid i.e., silicon die component to substrate, substrate to package and heat sink interface material for isometric heat transfer, are also highlighted. Hybrid realization of LDO faced various challenges as traditional packaging approach results in instable performance with extremely unmanageable thermal deals. Fabrication challenges and issues faced while designing functional & Burn-in test jigs are also addressed. Glidcop package qualification and hybrid realization process qualification details have also been presented in this article.