电源电弧

P. Singh, S. Mazzuca, Y. Yao, G. Galyon, V. Ronken, L. Hedlund, J. Kinnard
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引用次数: 1

摘要

在更小的空间内封装更多功率的趋势导致计算机电源在该领域的电弧率更高。功率密度的增加是通过减小功率链MOSFET引线等特征之间的间距和增加开关频率来实现的。这两种变化都使电源更容易产生场弧。本文介绍了一种预测电源电弧倾向的部分真空试验技术。局部真空测试还可以通过指示易产生电弧的位置,帮助确定避免现场电弧产生所需的纠正措施。该论文还描述了一种称为锌喷雾测试的测试,该测试可以帮助确定在高频谐波高压下不会在现场产生弧的特征之间的最小间距。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Power supply arcing
The trend to pack more power in smaller spaces is leading to higher rates of computer power supply arcing in the field. Power density increase is being achieved by decreasing the spacing between features such as the power train MOSFET leads and by increasing the switching frequency. Both of these changes make power supplies more prone to field arcing. This paper discloses a technique called the partial vacuum test to predict the arcing propensity in power supplies. The partial vacuum test also helps determine the corrective actions needed to avoid field arcing by indicating the locations susceptible to arcing. The paper also describes a test called the zinc spray test that can help determine the minimum spacing between features, subjected to high voltages with high frequency harmonics, that will not arc in the field.
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