硅门控场发射体失效机理的研究

R. Bhattacharjee, Ranajoy Bhattacharva, S. Guerrera, Nedeliko Karaulac, G. Rughoobur, W. Chern, A. Akinwande, J. Browning
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引用次数: 0

摘要

门控场发射极阵列(GFEAs)可能由于各种机制而失效,这些机制尚不清楚。本文采用仿真和实验方法对几种提出的失效机制进行了研究。使用CST进行的建模考虑了离子轰击区,以计算击中发射器尖端顶端的离子的位置和数量。当离子的起始位置远离尖端时,到达尖端尖端的分数增加到$5\mu \mathrm{m}$,然后减少直到只有在尖端正上方产生的离子影响。电弧的电测量表明,电弧只发生在有发射的正偏压时,而不是在反向偏压时,这表明机理不是表面击穿。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Understanding the Failure Mechanisms of Silicon Gated Field Emitters
Gated field emitter arrays (GFEAs) can fail due to various mechanisms which are not well understood. In this paper, several proposed failure mechanisms are investigated using simulation and experiment. The modelling performed using CST considers an ion bombardment zone to calculate the locations and number of ions that hit the emitter tip apex. As the starting location of the ions moves away from the tip, the fraction hitting the tip apex increases until $5\mu \mathrm{m}$ from the tip and then decreases until only ions born directly above the tip impact. Electrical measurements of arcs show that arcs only occur during forward bias with emission rather than in reverse bias indicating the mechanism is not surface breakdown.
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