VBGA封装的热性能评价

Wenjie Zheng, P.Y.F. Wu, James J. D. Lan
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引用次数: 0

摘要

利用光可成像介质(PID)材料和微填充孔(MfVia)技术制备了ViperBGA (VBGA),这是一种热增强型BGA封装衬底。通过JEDEC标准的风洞试验和有限元模拟对VBGA封装的热性能进行了评价。结果表明,任何给定封装的热阻Θja都可以近似为功率水平和气流速度的有理函数。这种表达式的一个优点是可以自信地预测任何条件下封装的热阻,另一个优点是可以实现更可靠的数值预测。本文还介绍了如何根据传热系数和其他因素建立风洞试验的可靠有限元模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal Performance Evaluation of VBGA Packages
Photo-imageable-dielectric (PID) materials and the Micro-filled Via (MfVia) technology are utilized to make the ViperBGA (VBGA), a thermally enhanced BGA package substrate. The thermal performance of the VBGA packages was evaluated by wind tunnel tests of JEDEC standard and FEM simulations. It is shown that the thermal resistance Θja of any given package can be approximated by a rational function of the power level and the airflow speed. One advantage of such expression is that the thermal resistance of the package under any condition can be confidently predicted, and the other is that more reliable numerical predictions can be achieved. This paper also describes how to approach a confident FEM modeling of the wind tunnel tests in terms of heat transfer coefficients and other factors.
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