用于热管理的CVD金刚石薄膜

Shusmitha Kyatam, J. Mendes, D. Mukherjee, Armindo Silva, Luis N. Alves, S. Rotter, M. Neto, Filipe F. Oliveira, Rui F. Silva, Hugo Neto
{"title":"用于热管理的CVD金刚石薄膜","authors":"Shusmitha Kyatam, J. Mendes, D. Mukherjee, Armindo Silva, Luis N. Alves, S. Rotter, M. Neto, Filipe F. Oliveira, Rui F. Silva, Hugo Neto","doi":"10.1109/COMCAS44984.2019.8958115","DOIUrl":null,"url":null,"abstract":"One of the stringent issues in modern electronic applications is related with the necessity of keeping the operating temperature of electronic components within safe levels. The use of passivation, board, and encapsulation materials with large thermal conductivity provides an efficient way of removing the excess heat without increasing the volume and weight of the electronic circuitry. Following this trend, diamond films deposited by chemical vapor deposition (CVD) offer a simple and efficient solution to maintain the operating temperature within safe limits. This paper discusses the use of CVD diamond films with HEMT devices, photonic integrated circuits and high power LEDs.","PeriodicalId":276613,"journal":{"name":"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)","volume":"256 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"CVD diamond films for thermal management applications\",\"authors\":\"Shusmitha Kyatam, J. Mendes, D. Mukherjee, Armindo Silva, Luis N. Alves, S. Rotter, M. Neto, Filipe F. Oliveira, Rui F. Silva, Hugo Neto\",\"doi\":\"10.1109/COMCAS44984.2019.8958115\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the stringent issues in modern electronic applications is related with the necessity of keeping the operating temperature of electronic components within safe levels. The use of passivation, board, and encapsulation materials with large thermal conductivity provides an efficient way of removing the excess heat without increasing the volume and weight of the electronic circuitry. Following this trend, diamond films deposited by chemical vapor deposition (CVD) offer a simple and efficient solution to maintain the operating temperature within safe limits. This paper discusses the use of CVD diamond films with HEMT devices, photonic integrated circuits and high power LEDs.\",\"PeriodicalId\":276613,\"journal\":{\"name\":\"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)\",\"volume\":\"256 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/COMCAS44984.2019.8958115\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/COMCAS44984.2019.8958115","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

在现代电子应用中,一个严格的问题是保持电子元件的工作温度在安全水平内的必要性。使用钝化、董事会和封装材料大热导率提供了一种有效的方法消除了多余的热量不增加电路的体积和重量。遵循这一趋势,化学气相沉积(CVD)沉积的金刚石膜提供了一种简单有效的解决方案,可以将操作温度保持在安全范围内。本文讨论了CVD金刚石薄膜在HEMT器件、光子集成电路和大功率led上的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CVD diamond films for thermal management applications
One of the stringent issues in modern electronic applications is related with the necessity of keeping the operating temperature of electronic components within safe levels. The use of passivation, board, and encapsulation materials with large thermal conductivity provides an efficient way of removing the excess heat without increasing the volume and weight of the electronic circuitry. Following this trend, diamond films deposited by chemical vapor deposition (CVD) offer a simple and efficient solution to maintain the operating temperature within safe limits. This paper discusses the use of CVD diamond films with HEMT devices, photonic integrated circuits and high power LEDs.
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