提高良率的CMOS混合信号电路工艺变化灵敏度表征

Daeik D. Kim, Choongyeun Cho, Jonghae Kim, J. Plouchart, R. Trzcinski, D. Ahlgren
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引用次数: 30

摘要

采用数值电路求解、统计仿真和实现电路测量方法,研究了65nm部分耗尽绝缘体上硅CMOS工艺中混合信号电路的性能和良率对工艺变化的依赖关系。65nm制程中增加的相对变化通过点对点和晶圆对晶圆制程的变化来检验。通过仿真和射频测量,将电流控制振荡器的性能与器件阈值电压相互关联。通过对仿真结果和电路测量的统计分析,得出振荡频率与器件阈值电压的相互关系高达93.9%,且模型-硬件相关性强。提出了设计、仿真、测量和统计分析的良率学习过程
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CMOS Mixed-Signal Circuit Process Variation Sensitivity Characterization for Yield Improvement
A mixed-signal circuit's performance and yield dependency on process variation are investigated with numerical circuit solution, statistical simulation, and implemented circuit measurement in 65nm partially-depleted silicon-on-insulator CMOS process. Increased relative variation in 65nm process is examined with site-to-site and wafer-to-wafer process variations. A current-controlled oscillator's performance and device threshold voltages are cross-correlated using simulation and RF measurement. Up to 93.9% cross-correlation between oscillation frequency and device threshold voltage is obtained, and strong model-to-hardware correlation is observed through statistical analysis of simulation result and circuit measurement. The yield learning process of design, simulation, measurement, and statistical analysis is proposed
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