锡膏干燥对可焊性的影响

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887592

A. Otáhal, M. Adamek, I. Szendiuch

{"title":"锡膏干燥对可焊性的影响","authors":"A. Otáhal, M. Adamek, I. Szendiuch","doi":"10.1109/ISSE.2014.6887592","DOIUrl":null,"url":null,"abstract":"This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"416 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Impact of solder paste drying on the solderability\",\"authors\":\"A. Otáhal, M. Adamek, I. Szendiuch\",\"doi\":\"10.1109/ISSE.2014.6887592\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.\",\"PeriodicalId\":375711,\"journal\":{\"name\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"volume\":\"416 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2014.6887592\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2014.6887592","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

研究了干燥后的SAC305免清洗锡膏对扩散系数的影响。干燥是通过模板印刷和回流焊之间的时间来定义的。研究的主要参数是扩散，即印刷后锡膏的圆直径与焊接后的圆直径之差的百分比。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Impact of solder paste drying on the solderability

This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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