H. Ueno, M. Hosaka, Y. Zhang, O. Tabata, S. Konishi, S. Sugiyama
{"title":"利用LIGA工艺制备高纵横比微细零件的研究","authors":"H. Ueno, M. Hosaka, Y. Zhang, O. Tabata, S. Konishi, S. Sugiyama","doi":"10.1109/MHS.1997.768856","DOIUrl":null,"url":null,"abstract":"In order to fabricate high-aspect ratio microparts for micro electro mechanical systems (MEMS), we have investigated the LIGA process. Exposure for deep X-ray lithography has been carried out using the world's smallest synchrotron radiation (SR) source, AURORA. An X-ray mask, which was composed of 5 /spl mu/m thick Au as an absorber and 2 /spl mu/m thick SiC as a membrane, was produced. As a resist, commercially available polymethyl-methacrylate (PMMA) sheets of a thickness above 200 /spl mu/m were directly glued by PMMA resin on Si wafers. Consequently, we could fabricate PMMA microstructures of 200 /spl mu/m height and 4 /spl mu/m width, an aspect ratio of about 50. Using these PMMA microstructures as molds, we electroformed 200 /spl mu/m high Ni microstructures with the maximum aspect ratio of 40. These results show there is a good prospect of fabricating high aspect ratio microparts for MEMS.","PeriodicalId":131719,"journal":{"name":"1997 International Symposium on Micromechanics and Human Science (Cat. No.97TH8311)","volume":"121 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Study on fabrication of high aspect ratio microparts using the LIGA process\",\"authors\":\"H. Ueno, M. Hosaka, Y. Zhang, O. Tabata, S. Konishi, S. Sugiyama\",\"doi\":\"10.1109/MHS.1997.768856\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In order to fabricate high-aspect ratio microparts for micro electro mechanical systems (MEMS), we have investigated the LIGA process. Exposure for deep X-ray lithography has been carried out using the world's smallest synchrotron radiation (SR) source, AURORA. An X-ray mask, which was composed of 5 /spl mu/m thick Au as an absorber and 2 /spl mu/m thick SiC as a membrane, was produced. As a resist, commercially available polymethyl-methacrylate (PMMA) sheets of a thickness above 200 /spl mu/m were directly glued by PMMA resin on Si wafers. Consequently, we could fabricate PMMA microstructures of 200 /spl mu/m height and 4 /spl mu/m width, an aspect ratio of about 50. Using these PMMA microstructures as molds, we electroformed 200 /spl mu/m high Ni microstructures with the maximum aspect ratio of 40. These results show there is a good prospect of fabricating high aspect ratio microparts for MEMS.\",\"PeriodicalId\":131719,\"journal\":{\"name\":\"1997 International Symposium on Micromechanics and Human Science (Cat. No.97TH8311)\",\"volume\":\"121 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 International Symposium on Micromechanics and Human Science (Cat. No.97TH8311)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MHS.1997.768856\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 International Symposium on Micromechanics and Human Science (Cat. No.97TH8311)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MHS.1997.768856","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study on fabrication of high aspect ratio microparts using the LIGA process
In order to fabricate high-aspect ratio microparts for micro electro mechanical systems (MEMS), we have investigated the LIGA process. Exposure for deep X-ray lithography has been carried out using the world's smallest synchrotron radiation (SR) source, AURORA. An X-ray mask, which was composed of 5 /spl mu/m thick Au as an absorber and 2 /spl mu/m thick SiC as a membrane, was produced. As a resist, commercially available polymethyl-methacrylate (PMMA) sheets of a thickness above 200 /spl mu/m were directly glued by PMMA resin on Si wafers. Consequently, we could fabricate PMMA microstructures of 200 /spl mu/m height and 4 /spl mu/m width, an aspect ratio of about 50. Using these PMMA microstructures as molds, we electroformed 200 /spl mu/m high Ni microstructures with the maximum aspect ratio of 40. These results show there is a good prospect of fabricating high aspect ratio microparts for MEMS.