利用LIGA工艺制备高纵横比微细零件的研究

H. Ueno, M. Hosaka, Y. Zhang, O. Tabata, S. Konishi, S. Sugiyama
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引用次数: 6

摘要

为了制造用于微机电系统(MEMS)的高纵横比微部件,我们研究了LIGA工艺。使用世界上最小的同步辐射(SR)源AURORA进行了深x射线光刻曝光。制备了以5 /spl μ m厚Au为吸收体,2 /spl μ m厚SiC为膜的x射线掩膜。作为抗蚀剂,市售的厚度在200 /spl mu/m以上的聚甲基丙烯酸甲酯(PMMA)片材直接用PMMA树脂粘接在硅晶片上。因此,我们可以制作高度为200 /spl亩/米、宽度为4 /spl亩/米的PMMA微结构,长宽比约为50。利用这些PMMA微结构作为模具,电铸了200 /spl mu/m的高镍微结构,最大纵横比为40。这些结果表明,制造高纵横比微电子器件具有良好的前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on fabrication of high aspect ratio microparts using the LIGA process
In order to fabricate high-aspect ratio microparts for micro electro mechanical systems (MEMS), we have investigated the LIGA process. Exposure for deep X-ray lithography has been carried out using the world's smallest synchrotron radiation (SR) source, AURORA. An X-ray mask, which was composed of 5 /spl mu/m thick Au as an absorber and 2 /spl mu/m thick SiC as a membrane, was produced. As a resist, commercially available polymethyl-methacrylate (PMMA) sheets of a thickness above 200 /spl mu/m were directly glued by PMMA resin on Si wafers. Consequently, we could fabricate PMMA microstructures of 200 /spl mu/m height and 4 /spl mu/m width, an aspect ratio of about 50. Using these PMMA microstructures as molds, we electroformed 200 /spl mu/m high Ni microstructures with the maximum aspect ratio of 40. These results show there is a good prospect of fabricating high aspect ratio microparts for MEMS.
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