芳纶材料热老化性能评价的新方法

2011 Electrical Insulation Conference (EIC). Pub Date : 2011-06-05 DOI:10.1109/EIC.2011.5996196

S. A. Filliben

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引用次数: 6

摘要

为了解芳纶纸与铜的接触性能，提出了一种新的测试方法。基本的性能测试可能表明，同一化学家族的产品会提供相同的性能。这种热降解测试方法可用于量化产品之间的性能差异，并允许设计人员为应用选择合适的产品。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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New test method to evaluate the thermal aging of aramid materials

A new test method has been developed to understand the performance of aramid paper in contact with copper. Basic property tests might suggest products in the same chemical family would deliver equivalent performance. This thermal degradation testing method can be used to quantify performance differences between products and allow the designer to select the proper product for the application.

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来源期刊

2011 Electrical Insulation Conference (EIC).

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