GaN器件技术:制造、表征、建模和验证

W. Ciccognani, F. Giannini, E. Limit, P. Longhi, M.A. Nanni, A. Serino, C. Lanzieri, M. Peroni, P. Romanini, V. Camarchia, M. Pirola, G. Ghione
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引用次数: 12

摘要

与其他半导体相比,氮化镓优越的物理特性使GaNHEMT有源器件成为雷达系统、3G/4G基站和WiMAX下一代发射机的主要候选器件。在这一贡献,表征,建模和验证不同家族的高效率,高功率的器件制造SELEX系统集成报告。分析了工艺、表征和建模阶段,以改进和完善该技术的制造技术、热降解问题和分散现象。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
GaN Device Technology: Manufacturing, Characterization, Modelling and Verification
Gallium Nitride's superior physical properties, in comparison with other semiconductors, make GaNHEMT active devices a prime candidate in the implementation of next generation transmitters for radar systems, 3G/4G base stations and WiMAX. In this contribution, the characterization, modelling and verification of different families of high efficiency, high- power devices manufactured at SELEX Sistemi Integrati are reported. Process, characterization and modelling phases are analyzed to improve and refine the technology's fabrication techniques, thermal degradation issues and dispersion phenomena.
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