死区时间对Si、SiC和GaN变换器的影响

P. Skarolek, J. Lettl
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引用次数: 2

摘要

本文比较了硅超结(Si SJ)、碳化硅(SiC)和氮化镓(GaN)三种不同的晶体管技术在典型半桥变换器中的死区设置。根据测量结果,与硅SJ器件相比,新型快速开关晶体管SiC和GaN都需要精确的死区时间设置。当死区时间设置错误时,GaN的变换器效率比SiC下降得更快,而Si SJ器件受死区时间长度的影响最小。通过跟踪给定恒占空比和补偿后的最大输出电压和输入电压,可以找到DC/DC变换器的最佳死区时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of Deadtime on Si, SiC and GaN Converters
This paper presents a comparison of three different transistor technologies Silicon Superjunction (Si SJ), Silicon Carbide (SiC) and Gallium Nitride (GaN) in respect to deadtime setting in a typical halfbridge converter. According to the measured results both new fast switching transistors SiC and GaN needs precise deadtime setting compared to the Si SJ devices. With wrong deadtime settings the converter efficiency drops more rapidly for GaN compared to SiC while the Si SJ device is the least affected by the deadtime length. The optimum deadtime in DC/DC converter can be found by tracking the maximum output voltage for given constant and compensated duty cycle and input voltage.
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