欠充填对倒装接头可靠性的有益影响

Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) Pub Date : 1997-10-26 DOI:10.1109/PEP.1997.656506

B. Roesner

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引用次数: 5

摘要

近年来，人们研究了几种低成本的倒装芯片互连技术。本文的研究范围是各种衬底(主要是FR4)上的倒装芯片组件的可靠性研究。描述了各向同性导电胶粘剂和焊料(63Sn37Pb, 96.5Sn3.5Ag)凸点在热循环和热冲击下的劣化(以电阻为特征)。这些研究证实，在低成本倒装芯片技术中，如果不使用下填充材料，实际上就没有可靠的凸点互连。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The beneficial effect of underfilling on the reliability of flip-chip joints

Recently, several low cost alternatives for flip-chip interconnection technology have been investigated. The scope of this paper is a reliability study of flip-chip assemblies on various substrates (mainly FR4). The deterioration (characterised by the electrical resistance) of isotropically conductive adhesive and of solder (63Sn37Pb, 96.5Sn3.5Ag) bumps caused by both thermal cycling and thermal shocks are described. These investigations confirm that in low cost flip-chip technology, there is practically no reliable bump interconnection without using underfill material.

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Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)

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