三轴MEMS加速度计封装效应补偿方法

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2016-05-01 DOI:10.1109/ITHERM.2016.7517594

Chia-Cheng Chang, Hung-Te Yang, Yen-Fu Su, Yu-Ting Hong, K. Chiang

{"title":"三轴MEMS加速度计封装效应补偿方法","authors":"Chia-Cheng Chang, Hung-Te Yang, Yen-Fu Su, Yu-Ting Hong, K. Chiang","doi":"10.1109/ITHERM.2016.7517594","DOIUrl":null,"url":null,"abstract":"This paper discusses about the residual stress and packaging effect of three-axis micro-electro-mechanical system (MEMS) accelerometer. The 3D FEM model with modal analysis method is adopted for the resonance frequency estimation. This paper also presents a simple compensation model for trimming the offset of capacitance differentiation using the measured resonance frequency. This trimmming methodology can be realized by adjusting circuit gain in real product.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"A method to compensate packaging effects on three-axis MEMS accelerometer\",\"authors\":\"Chia-Cheng Chang, Hung-Te Yang, Yen-Fu Su, Yu-Ting Hong, K. Chiang\",\"doi\":\"10.1109/ITHERM.2016.7517594\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses about the residual stress and packaging effect of three-axis micro-electro-mechanical system (MEMS) accelerometer. The 3D FEM model with modal analysis method is adopted for the resonance frequency estimation. This paper also presents a simple compensation model for trimming the offset of capacitance differentiation using the measured resonance frequency. This trimmming methodology can be realized by adjusting circuit gain in real product.\",\"PeriodicalId\":426908,\"journal\":{\"name\":\"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2016.7517594\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2016.7517594","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

本文讨论了三轴微机电系统加速度计的残余应力和封装效应。采用三维有限元模型和模态分析方法进行共振频率估计。本文还提出了一种简单的补偿模型，利用测量的谐振频率来修整电容微分的偏移。这种滤波方法可以通过在实际产品中调整电路增益来实现。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A method to compensate packaging effects on three-axis MEMS accelerometer

This paper discusses about the residual stress and packaging effect of three-axis micro-electro-mechanical system (MEMS) accelerometer. The 3D FEM model with modal analysis method is adopted for the resonance frequency estimation. This paper also presents a simple compensation model for trimming the offset of capacitance differentiation using the measured resonance frequency. This trimmming methodology can be realized by adjusting circuit gain in real product.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

自引率

0.00%

发文量