{"title":"静态CMOS电路中电流可测试故障的测试模式生成","authors":"F. Ferguson, T. Larrabee","doi":"10.1109/VTEST.1991.208174","DOIUrl":null,"url":null,"abstract":"Many manufacturing defects in static CMOS circuits are not detected by tests generated using the traditional single stuck-at fault model. May of these defects may be detected as increased propagation time or as excessive quiescent power supply current (IDDQ). In this paper the authors consider the probable manufacturing defects and compare the costs of detecting them by the resulting excess IDDQ versus the cost of traditional testing methods.<<ETX>>","PeriodicalId":157539,"journal":{"name":"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Test pattern generation for current testable faults in static CMOS circuits\",\"authors\":\"F. Ferguson, T. Larrabee\",\"doi\":\"10.1109/VTEST.1991.208174\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Many manufacturing defects in static CMOS circuits are not detected by tests generated using the traditional single stuck-at fault model. May of these defects may be detected as increased propagation time or as excessive quiescent power supply current (IDDQ). In this paper the authors consider the probable manufacturing defects and compare the costs of detecting them by the resulting excess IDDQ versus the cost of traditional testing methods.<<ETX>>\",\"PeriodicalId\":157539,\"journal\":{\"name\":\"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's\",\"volume\":\"59 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VTEST.1991.208174\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTEST.1991.208174","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Test pattern generation for current testable faults in static CMOS circuits
Many manufacturing defects in static CMOS circuits are not detected by tests generated using the traditional single stuck-at fault model. May of these defects may be detected as increased propagation time or as excessive quiescent power supply current (IDDQ). In this paper the authors consider the probable manufacturing defects and compare the costs of detecting them by the resulting excess IDDQ versus the cost of traditional testing methods.<>