使用片上3D-TRL校准的g波段MOM电容表征

A. Saadi, M. Margalef, S. L. Pilliet, C. Gaquière, D. Gloria, C. Durand, P. Ferrari
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引用次数: 5

摘要

本文利用3D-TRL校准技术对集成在BiCMOS 55纳米工艺中的金属氧化物金属(MOM)电容器进行了表征。利用三维电磁(EM)仿真,设计了优化的3D- trl标准,以消除后端线的影响,并在低电平金属(metal 4)的MOM访问线上定义新的参考平面。在140 ~ 220 GHz的频率范围内,很好地提取了固有的MOM参数,并在3D EM仿真、Design-kit仿真和测量之间达成了良好的一致性。在EM仿真的基础上,将3D-TRL与传统TRL进行了比较。这证明了3D-TRL在寄生虫抗性提取中的优势。据作者所知,这是第一次在这个频率范围内准确表征MOM电容器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
MOM Capacitance Characterization in G-Band using On-wafer 3D-TRL Calibration
In this paper Metal-Oxide-Metal (MOM) capacitors integrated in a BiCMOS 55-nm process are characterized by using 3D-TRL calibration technique. Using 3D electromagnetic (EM) simulation, optimized 3D-TRL standards were designed to cancel the impact of the Back-End-of-Line and define new reference planes at the MOM access-line on low level metal (Metal 4). The intrinsic MOM parameters were well extracted and good agreement was reached between, 3D EM simulation, Design-kit simulation and measurement within the frequency range from 140 to 220 GHz. Further, based on EM simulation, the 3D-TRL was compared to the conventional TRL. This proved the advantage of the 3D-TRL in the parasitic resistance extraction. To the best of author’s knowledge, it is the first time that MOM capacitors are accurately characterized in this frequency range.
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