Joshua C. Nation, J. Fiering, Doug White, Michael P. Abban, M. Culpepper, A. Duwel
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A new method to fabricate low-loss chip-scale RF inductors
A new method is presented for integrating high performance wire-based inductors into thin, planar, chip-scale formats. The method is designed for compatibility with commonly-used rapid prototyping tools, and fabrication can be automated for volume production. The chip-scale inductors are designed for inductances in the 1-10 nH range, self-resonant frequencies above 5 GHz, and quality factors exceeding 75-100. The process can produce a stand-alone chip or can be integrated with existing multi-chip modules and integrated circuits.
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