3D Lithography and Deposition on Highly Structured Surfaces Using Plasma Surface Modification, SAM Coating, and Contact Displacement Electroless Plating

This study presents a simple process to realize the lithography and deposition on a complicated 3D substrate surface conformally. The 3D lithography and patterning on highly structured surface is implemented using the SAM coating and the plasma treatment. Moreover, the selective film deposition on 3D surface and even underneath the suspended microstructures is realized using the contact displacement electroless plating (CDE plating). In applications, the Cu film was conformally plated and patterned on a Si substrate with 50μm~200μm deep cavities and 54.7°~90° sidewalls. Moreover, the Cu electrode underneath suspended microbeams was also plated.