{"title":"IBM中设备应用程序的CMP发现动态","authors":"K. D. Beyer","doi":"10.11470/OUBUTSU.90.2_119","DOIUrl":null,"url":null,"abstract":"In 1968 I was hired by IBM as a staff chemist and worked for eight years at assigned topics like doped oxide diffusions, material stress, impurity gettering, and silicon wafer cleaning. For the next five years, I was part of the computer chip reliability group. There I learned about the dependence of silicon chip yields on the reduction of particulate and mobile ion contamination.","PeriodicalId":319943,"journal":{"name":"2015 International Conference on Planarization/CMP Technology (ICPT)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The dynamics of the CMP discovery for device applications in IBM\",\"authors\":\"K. D. Beyer\",\"doi\":\"10.11470/OUBUTSU.90.2_119\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In 1968 I was hired by IBM as a staff chemist and worked for eight years at assigned topics like doped oxide diffusions, material stress, impurity gettering, and silicon wafer cleaning. For the next five years, I was part of the computer chip reliability group. There I learned about the dependence of silicon chip yields on the reduction of particulate and mobile ion contamination.\",\"PeriodicalId\":319943,\"journal\":{\"name\":\"2015 International Conference on Planarization/CMP Technology (ICPT)\",\"volume\":\"109 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 International Conference on Planarization/CMP Technology (ICPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.11470/OUBUTSU.90.2_119\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 International Conference on Planarization/CMP Technology (ICPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.11470/OUBUTSU.90.2_119","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The dynamics of the CMP discovery for device applications in IBM
In 1968 I was hired by IBM as a staff chemist and worked for eight years at assigned topics like doped oxide diffusions, material stress, impurity gettering, and silicon wafer cleaning. For the next five years, I was part of the computer chip reliability group. There I learned about the dependence of silicon chip yields on the reduction of particulate and mobile ion contamination.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
