用PICA进行更快IC分析的新方法:STPC-3D

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Pub Date : 2003-07-07 DOI:10.1109/IPFA.2003.1222736

R. Desplats, G. Faggion, F. Beaudoin, P. Perdu, T. Lundquist, K. Shah, A. Chion, M. Vallet, P. Sardin

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引用次数: 6

摘要

为了减少PICA(皮秒成像电路分析)的采集时间，我们开发了一种时空光子相关方法(STPC-3D)，将采集时间从几小时减少到几分钟。介绍了几种器件(即Azuma 0.18 /spl mu/m-1.8 V, Lazarus 0.18 /spl mu/m-1.8 V和STm 0.12 /spl mu/m-1.2 V)上的应用，展示了晶体管及其换流。

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A new approach for faster IC analysis with PICA: STPC-3D

To reduce acquisition time with PICA (Picosecond Imaging Circuit Analysis), we have developed a Spatial Temporal Photon Correlation approach (STPC-3D) which reduces acquisition from hours to minutes. Applications are presented on several devices (i.e., Azuma 0.18 /spl mu/m-1.8 V, Lazarus 0.18 /spl mu/m-1.8 V and STm 0.12 /spl mu/m-1.2 V) showing transistors and their commutations.

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Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

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