ParaMitE:在未蚀刻碳纳米管存在下减轻寄生cnfet

Sanmitra Banerjee, Arjun Chaudhuri, Jinwoo Kim, Gauthaman Murali, M. Nelson, S. Lim, K. Chakrabarty
{"title":"ParaMitE:在未蚀刻碳纳米管存在下减轻寄生cnfet","authors":"Sanmitra Banerjee, Arjun Chaudhuri, Jinwoo Kim, Gauthaman Murali, M. Nelson, S. Lim, K. Chakrabarty","doi":"10.1109/ICCAD51958.2021.9643513","DOIUrl":null,"url":null,"abstract":"Carbon nanotube FETs (CNFETs) are emerging as an alternative to silicon devices for next-generation computing systems. However, imperfect carbon nanotube deposition during CNFET fabrication can lead to the formation of difficult-to-etch CNT aggregates in the active layer. These CNT aggregates can form parasitic CNFETs (para-FETs) that are modulated by adjoining gate contacts or back-end-of-line metal layers, thereby forming conditional shorts and stuck-at faults. We show that even weak (parametric) para-FETs can lead to a degraded static noise margin in CNFET-based design. We propose ParaMitE, a layout optimization method that horizontally flips selected standard cells in situ to minimize the number of para-FETs that can arise due to unetched CNTs. As we modify only the cell orientation (and not the cell placement), the impact on the power, timing, and wire length of the CNFET-based design is negligible. Simulation results for several benchmarks show that the proposed method can mitigate up to 60% of the possible para-FET locations (90% of the most critical locations) with only a 3% increase in the total wire length. ParaMitE can enable yield ramp-up at the foundry by providing guidance on which para-FETs can be avoided by design, and conversely, which CNT aggregates must be removed through processing steps.","PeriodicalId":370791,"journal":{"name":"2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"ParaMitE: Mitigating Parasitic CNFETs in the Presence of Unetched CNTs\",\"authors\":\"Sanmitra Banerjee, Arjun Chaudhuri, Jinwoo Kim, Gauthaman Murali, M. Nelson, S. Lim, K. Chakrabarty\",\"doi\":\"10.1109/ICCAD51958.2021.9643513\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Carbon nanotube FETs (CNFETs) are emerging as an alternative to silicon devices for next-generation computing systems. However, imperfect carbon nanotube deposition during CNFET fabrication can lead to the formation of difficult-to-etch CNT aggregates in the active layer. These CNT aggregates can form parasitic CNFETs (para-FETs) that are modulated by adjoining gate contacts or back-end-of-line metal layers, thereby forming conditional shorts and stuck-at faults. We show that even weak (parametric) para-FETs can lead to a degraded static noise margin in CNFET-based design. We propose ParaMitE, a layout optimization method that horizontally flips selected standard cells in situ to minimize the number of para-FETs that can arise due to unetched CNTs. As we modify only the cell orientation (and not the cell placement), the impact on the power, timing, and wire length of the CNFET-based design is negligible. Simulation results for several benchmarks show that the proposed method can mitigate up to 60% of the possible para-FET locations (90% of the most critical locations) with only a 3% increase in the total wire length. ParaMitE can enable yield ramp-up at the foundry by providing guidance on which para-FETs can be avoided by design, and conversely, which CNT aggregates must be removed through processing steps.\",\"PeriodicalId\":370791,\"journal\":{\"name\":\"2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAD51958.2021.9643513\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD51958.2021.9643513","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

碳纳米管场效应管(cnfet)正在成为下一代计算系统中硅器件的替代品。然而,在CNFET制造过程中,不完美的碳纳米管沉积会导致在活性层中形成难以蚀刻的碳纳米管聚集体。这些碳纳米管聚集体可以形成寄生的cnfet (para- fet),由相邻的栅极触点或后端线金属层调制,从而形成条件短路和卡在故障。研究表明,在基于cnfet的设计中,即使是弱(参数)准场效应管也会导致静态噪声裕度下降。我们提出了ParaMitE,这是一种布局优化方法,可将选定的标准单元水平翻转,以最大限度地减少由于未蚀刻碳纳米管而产生的para- fet的数量。由于我们只修改单元方向(而不是单元位置),因此对基于cnfet的设计的功率、时序和导线长度的影响可以忽略不计。几个基准测试的仿真结果表明,所提出的方法可以减少高达60%的可能的准场效应管位置(90%的最关键位置),而总导线长度仅增加3%。ParaMitE可以在铸造厂提供指导,通过设计可以避免哪些para- fet,反过来,哪些碳纳米管聚集体必须通过加工步骤去除,从而实现产量的提高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ParaMitE: Mitigating Parasitic CNFETs in the Presence of Unetched CNTs
Carbon nanotube FETs (CNFETs) are emerging as an alternative to silicon devices for next-generation computing systems. However, imperfect carbon nanotube deposition during CNFET fabrication can lead to the formation of difficult-to-etch CNT aggregates in the active layer. These CNT aggregates can form parasitic CNFETs (para-FETs) that are modulated by adjoining gate contacts or back-end-of-line metal layers, thereby forming conditional shorts and stuck-at faults. We show that even weak (parametric) para-FETs can lead to a degraded static noise margin in CNFET-based design. We propose ParaMitE, a layout optimization method that horizontally flips selected standard cells in situ to minimize the number of para-FETs that can arise due to unetched CNTs. As we modify only the cell orientation (and not the cell placement), the impact on the power, timing, and wire length of the CNFET-based design is negligible. Simulation results for several benchmarks show that the proposed method can mitigate up to 60% of the possible para-FET locations (90% of the most critical locations) with only a 3% increase in the total wire length. ParaMitE can enable yield ramp-up at the foundry by providing guidance on which para-FETs can be avoided by design, and conversely, which CNT aggregates must be removed through processing steps.
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