SWaP优化的L波段功率放大器机载应用

Lalbahadur Dube, Ashok Kumar V, P. Sen
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引用次数: 0

摘要

本文讨论了用于地面和机载应用的SWaP(尺寸,重量和功率)优化的l波段功率放大器的设计和开发。氮化镓晶体管作为主要的有源大功率元件,在本放大器设计中具有较高的效率。采用是德科技先进设计系统(ADS)仿真工具对功率放大器的输入输出匹配进行设计和优化,并对功率放大器进行瞬态仿真和电磁仿真。采用两个驱动级和一个功率级放大器设计了三级放大器。采用p沟道、n沟道mosfet和and栅极设计了GaN的偏置时序电路。放大器提供反极性保护和数字控制开关。该放大器使用8V-60V的单电源,其输出可以在两个天线端口之间切换。优化后的匹配网络在主功率级载波频率为1200mhz、带宽为100mhz时,输出功率大于4w,功率增益为15db,功率附加效率(PAE)大于50%。两个天线端口之间的隔离度大于50db。该放大器在- 20°C至+55°C的温度范围内设计了热补偿,输出功率大于4瓦。硬件采用总厚度为1.6 mm的混合四层PCB在Rogers 450b和fr -4基板上实现。顶层20mil罗杰斯450b用于射频路由。由于尺寸限制,组件填充在PCB的两侧。SWaP优化放大器已在机械外壳中实现,尺寸为124 mm x 86 mm x 31.5 mm(长×宽×高),重量为480克,配有额外的安装螺柱。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SWaP Optimised L -Band Power Amplifier for Airborne Applications
This paper discusses the design and development of a SWaP (size, weight and power) optimized L-Band Power Amplifier for Ground and Airborne applications. GaN transistors the main active high-power element in this amplifier designs for high efficiency. Keysight Advance Design System (ADS) simulation tool is used to design and optimize the input and output matching along with transient & EM simulation of power amplifier. The 3-stage amplifier has been designed using two driver stages and one power stage amplifier. The bias sequencing circuit for GaN is designed using P-channel, N-channel MOSFETs and AND gates. The amplifier has provision of reverse polarity protection and switching on/off by digital controls. This amplifier works with single power supply which can range from 8V-60V and its output can be switched between two antenna ports. With optimized matching networks, more than 4-watt output power, power gain of 15 dB and power added efficiency (PAE) of more than 50% are obtained at carrier frequency of 1200 MHz and band width of 100 MHz of main power stage. The isolation between the two antenna ports is more than 50 db. The amplifier has been designed with thermal compensation for power output of more than 4 watt in the temperature range of - 20°C to +55°C. The hardware realized using mixed four-layer PCB with the total thickness of 1.6 mm on Rogers 4350B and FR-4substrate. The top Layer 20 mil Rogers 4350B is used for RF routing. Components are populated on both side of the PCB due to size constraint. The SWaP optimized amplifier has been realized in mechanical housing with the size of 124 mm x 86 mm x 31.5 mm (LxWxH) and weight of 480 gm with extra mounting studs for fitment.
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