桥阻式压力膜片传感器的ESD性能

Kuo-Lung Lei, C.Y. Chu, J. Tseng, Yuh-Min Chiang, M. Young
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引用次数: 1

摘要

基于桥阻的压力膜片传感器(包括微加工硅传感器和高性能薄膜传感器)的ESD性能基于传感器跨度和偏移作为失效准则进行评估。不同厂商生产的微机械硅传感器在ESD性能上存在相当大的差异。研究发现,传感元件的结构和布局对传感器ESD的鲁棒性有重要影响。还开发了一套入厂鉴定程序,以进一步帮助传感器应用公司筛选来自不同供应商的传感元件。此外,还指出了当前设计中的薄弱环节。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ESD performance of bridge-resistance pressure diaphragm sensors
The ESD performance of bridge-resistance based pressure diaphragm sensors, including micromachined silicon sensors and high-performance thin film sensors, is evaluated based on sensor span and offset as failure criteria. Different micromachined silicon sensors from different vendors show considerable differences in ESD performance. It is found that sensing element construction and layout contributes significantly to sensor ESD robustness. An incoming qualifying procedure is also developed to further help sensor application companies to screen sensing elements from different vendors. In addition, weak spots in current design are also identified.
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