{"title":"利用并行驱动ic提高传输线耦合器的通信距离","authors":"Yamato Toyoda, M. Hamada, T. Kuroda","doi":"10.1109/EDAPS50281.2020.9312888","DOIUrl":null,"url":null,"abstract":"Non-contact communication can be realized by using a transmission line coupler. A highly durable system can be created by using contactless communication. The transmission line coupler has a trade-off relationship between long-distance transmission and compact packaging, which is an implementation issue. In this paper, we have developed a system that doubles the transmission power by parallelizing the driver ICs and achieves both compact packaging and communication distance enhancement.","PeriodicalId":137699,"journal":{"name":"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Communication Distance Enhancement of Transmission Line Coupler by Using Parallelized Driver ICs\",\"authors\":\"Yamato Toyoda, M. Hamada, T. Kuroda\",\"doi\":\"10.1109/EDAPS50281.2020.9312888\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Non-contact communication can be realized by using a transmission line coupler. A highly durable system can be created by using contactless communication. The transmission line coupler has a trade-off relationship between long-distance transmission and compact packaging, which is an implementation issue. In this paper, we have developed a system that doubles the transmission power by parallelizing the driver ICs and achieves both compact packaging and communication distance enhancement.\",\"PeriodicalId\":137699,\"journal\":{\"name\":\"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS50281.2020.9312888\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS50281.2020.9312888","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Communication Distance Enhancement of Transmission Line Coupler by Using Parallelized Driver ICs
Non-contact communication can be realized by using a transmission line coupler. A highly durable system can be created by using contactless communication. The transmission line coupler has a trade-off relationship between long-distance transmission and compact packaging, which is an implementation issue. In this paper, we have developed a system that doubles the transmission power by parallelizing the driver ICs and achieves both compact packaging and communication distance enhancement.
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