Thermal Conductivity of Epoxy Composites Filled with Polydopamine and Goupling Agent Functionalized Boron Nitride

As the voltage level increases, the high-voltage equipment will generate more heat under special working conditions, so there is a new requirement for the thermal conductivity of the insulating material. The addition of a highly thermally conductive filler to an insulating resin matrix is a simple and effective method. Hexagonal boron nitride (h-BN) is a good filler for improving the thermal conductivity of the resin due to its high thermal conductivity and thermal stability. However, the boron nitride surface is smooth, has fewer functional groups, and has poor compatibility with the substrate. In this paper, the self-polymerization of dopamine is chemically coated on the surface of BN with a layer of polydopamine (PDA), the PDA layer is used as a secondary reaction platform. and modified with γ-aminopropyltriethoxysilane (KH550). Three different composite materials were prepared by mixing the treated particles with an epoxy resin. The effect of surface treatment on the dispersibility and thermal conductivity of the filler was investigated.