改进中压开关柜散热性能的仿真研究与实验验证

Zengbin Wang, Rui Wang, Chao-Bo Yan, Lijun Wang, Ji Wu
{"title":"改进中压开关柜散热性能的仿真研究与实验验证","authors":"Zengbin Wang, Rui Wang, Chao-Bo Yan, Lijun Wang, Ji Wu","doi":"10.1109/ICEPE-ST.2019.8928705","DOIUrl":null,"url":null,"abstract":"As protective equipment of the electrical power systems, switching device is of great importance in the transmission and distribution of the power systems. Switchgear is widely used in the medium power system. Long-term excessive temperature rise will lead to reduction of insulation property and mechanical property, which may finally lead to fatal accidents. To maintain safe and stable operation of switch-gear, long-term excessive temperature rise has to be avoided. The research on the distribution of temperature in the switch-gear is of great importance for the optimum design and improvement of service life of switch-gear. Based on electromagnetic-fluid-temperature coupling, multi-physics simulations are adopted to analyze the temperature rise distribution of switch-gear. In this paper, we conducted simulations and experiments to analyze the temperature rise of a medium-voltage switchgear whose rated current is 4000A. The 3D model of the switch-gear is established in UG with 1:1 ratio. To achieve high accuracy, contact resistance at the vacuum interrupters and the tulip contact is considered in the 3D model. The simulations are conducted with ANSYS Multiphysics and CFX coupling. In the ANSYS section, the heat generated by the alternating current is obtained and later transported to CFX as energy source. In the CFX section, thermal-fluid coupling simulation is conducted and the temperature rise distribution is obtained. Using this method, the temperature rise of the switch-gear is firstly simulated and analyzed, and simulation results also are compared with the experiment result. Comparison result verified the correctness of simulation result. Secondly, a heat dissipation improvement method is put forward to reduce the temperature rise of the medium-voltage switchgear. Simulation and experiment on the modified switchgear model is conducted. By simulation and experiment, it can be found that the method is effective in reduction of the temperature rise of the switch-gear.","PeriodicalId":392306,"journal":{"name":"2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Heat Dissipation Improvement of Medium-Voltage Switch-gear: Simulation Study and Experimental Validation\",\"authors\":\"Zengbin Wang, Rui Wang, Chao-Bo Yan, Lijun Wang, Ji Wu\",\"doi\":\"10.1109/ICEPE-ST.2019.8928705\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As protective equipment of the electrical power systems, switching device is of great importance in the transmission and distribution of the power systems. Switchgear is widely used in the medium power system. Long-term excessive temperature rise will lead to reduction of insulation property and mechanical property, which may finally lead to fatal accidents. To maintain safe and stable operation of switch-gear, long-term excessive temperature rise has to be avoided. The research on the distribution of temperature in the switch-gear is of great importance for the optimum design and improvement of service life of switch-gear. Based on electromagnetic-fluid-temperature coupling, multi-physics simulations are adopted to analyze the temperature rise distribution of switch-gear. In this paper, we conducted simulations and experiments to analyze the temperature rise of a medium-voltage switchgear whose rated current is 4000A. The 3D model of the switch-gear is established in UG with 1:1 ratio. To achieve high accuracy, contact resistance at the vacuum interrupters and the tulip contact is considered in the 3D model. The simulations are conducted with ANSYS Multiphysics and CFX coupling. In the ANSYS section, the heat generated by the alternating current is obtained and later transported to CFX as energy source. In the CFX section, thermal-fluid coupling simulation is conducted and the temperature rise distribution is obtained. Using this method, the temperature rise of the switch-gear is firstly simulated and analyzed, and simulation results also are compared with the experiment result. Comparison result verified the correctness of simulation result. Secondly, a heat dissipation improvement method is put forward to reduce the temperature rise of the medium-voltage switchgear. Simulation and experiment on the modified switchgear model is conducted. By simulation and experiment, it can be found that the method is effective in reduction of the temperature rise of the switch-gear.\",\"PeriodicalId\":392306,\"journal\":{\"name\":\"2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPE-ST.2019.8928705\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPE-ST.2019.8928705","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

开关装置作为电力系统的保护设备,在电力系统的输配电中起着十分重要的作用。开关柜在中功率系统中有着广泛的应用。长期过高的温升将导致绝缘性能和力学性能下降,最终可能导致致命事故。为了保证开关柜的安全稳定运行,必须避免长期过高的温升。研究开关柜内部的温度分布对优化设计和提高开关柜的使用寿命具有重要意义。基于电磁-流-温耦合,采用多物理场仿真分析了开关柜的温升分布。本文对额定电流为4000A的中压开关柜的温升进行了仿真和实验分析。在UG中以1:1的比例建立了开关柜的三维模型。为了达到高精度,在三维模型中考虑了真空灭流器和郁金香触点的接触电阻。利用ANSYS Multiphysics和CFX耦合进行了仿真。在ANSYS截面中,获取交流电产生的热量,并将其作为能量源输送到CFX。在CFX段进行了热流耦合模拟,得到了温升分布。利用该方法首先对开关柜的温升进行了仿真分析,并将仿真结果与实验结果进行了比较。对比结果验证了仿真结果的正确性。其次,提出了降低中压开关柜温升的散热改进方法。对改进后的开关柜模型进行了仿真和实验。通过仿真和实验,可以发现该方法对降低开关设备的温升是有效的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Heat Dissipation Improvement of Medium-Voltage Switch-gear: Simulation Study and Experimental Validation
As protective equipment of the electrical power systems, switching device is of great importance in the transmission and distribution of the power systems. Switchgear is widely used in the medium power system. Long-term excessive temperature rise will lead to reduction of insulation property and mechanical property, which may finally lead to fatal accidents. To maintain safe and stable operation of switch-gear, long-term excessive temperature rise has to be avoided. The research on the distribution of temperature in the switch-gear is of great importance for the optimum design and improvement of service life of switch-gear. Based on electromagnetic-fluid-temperature coupling, multi-physics simulations are adopted to analyze the temperature rise distribution of switch-gear. In this paper, we conducted simulations and experiments to analyze the temperature rise of a medium-voltage switchgear whose rated current is 4000A. The 3D model of the switch-gear is established in UG with 1:1 ratio. To achieve high accuracy, contact resistance at the vacuum interrupters and the tulip contact is considered in the 3D model. The simulations are conducted with ANSYS Multiphysics and CFX coupling. In the ANSYS section, the heat generated by the alternating current is obtained and later transported to CFX as energy source. In the CFX section, thermal-fluid coupling simulation is conducted and the temperature rise distribution is obtained. Using this method, the temperature rise of the switch-gear is firstly simulated and analyzed, and simulation results also are compared with the experiment result. Comparison result verified the correctness of simulation result. Secondly, a heat dissipation improvement method is put forward to reduce the temperature rise of the medium-voltage switchgear. Simulation and experiment on the modified switchgear model is conducted. By simulation and experiment, it can be found that the method is effective in reduction of the temperature rise of the switch-gear.
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