提高三维PCM存储系统可靠性的防过热重映射方案

Yu-Chen Lin, Tse-Yuan Wang, Che-Wei Tsao, Yuan-Hao Chang, Jian-Jia Chen, Xue Liu, Tei-Wei Kuo
{"title":"提高三维PCM存储系统可靠性的防过热重映射方案","authors":"Yu-Chen Lin, Tse-Yuan Wang, Che-Wei Tsao, Yuan-Hao Chang, Jian-Jia Chen, Xue Liu, Tei-Wei Kuo","doi":"10.1145/3400286.3418248","DOIUrl":null,"url":null,"abstract":"With the trend of 3D architecture and higher access rate, Phase Change Memory (PCM) storage devices face the overheating issue. This work is motivated by the observation that PCM devices might change states of memory cells with high temperature, and it will hurt the reliability of 3D PCM storage systems. Hence, we propose an Overheating-Avoidance Remapping Scheme (OARS) that controls the temperature of PCM layers and achieves wear-leveling of PCM cells inside PCM devices. Besides, we also take remapping overhead into consideration. The experiments were conducted based on the representative realistic workloads, and the results demonstrate the efficacy of the proposed scheme.","PeriodicalId":326100,"journal":{"name":"Proceedings of the International Conference on Research in Adaptive and Convergent Systems","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2020-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Overheating-Avoidance Remapping Scheme for Reliability Enhancement of 3D PCM Storage Systems\",\"authors\":\"Yu-Chen Lin, Tse-Yuan Wang, Che-Wei Tsao, Yuan-Hao Chang, Jian-Jia Chen, Xue Liu, Tei-Wei Kuo\",\"doi\":\"10.1145/3400286.3418248\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the trend of 3D architecture and higher access rate, Phase Change Memory (PCM) storage devices face the overheating issue. This work is motivated by the observation that PCM devices might change states of memory cells with high temperature, and it will hurt the reliability of 3D PCM storage systems. Hence, we propose an Overheating-Avoidance Remapping Scheme (OARS) that controls the temperature of PCM layers and achieves wear-leveling of PCM cells inside PCM devices. Besides, we also take remapping overhead into consideration. The experiments were conducted based on the representative realistic workloads, and the results demonstrate the efficacy of the proposed scheme.\",\"PeriodicalId\":326100,\"journal\":{\"name\":\"Proceedings of the International Conference on Research in Adaptive and Convergent Systems\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Research in Adaptive and Convergent Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/3400286.3418248\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Research in Adaptive and Convergent Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/3400286.3418248","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

随着三维结构和更高存取率的趋势,相变存储器(PCM)存储设备面临着过热问题。这项工作的动机是观察到PCM器件可能在高温下改变存储单元的状态,这将损害3D PCM存储系统的可靠性。因此,我们提出了一种避免过热重映射方案(OARS),该方案控制PCM层的温度并实现PCM器件内PCM单元的磨损均衡。此外,我们还考虑了重新映射的开销。在具有代表性的实际工作负载上进行了实验,结果证明了该方案的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Overheating-Avoidance Remapping Scheme for Reliability Enhancement of 3D PCM Storage Systems
With the trend of 3D architecture and higher access rate, Phase Change Memory (PCM) storage devices face the overheating issue. This work is motivated by the observation that PCM devices might change states of memory cells with high temperature, and it will hurt the reliability of 3D PCM storage systems. Hence, we propose an Overheating-Avoidance Remapping Scheme (OARS) that controls the temperature of PCM layers and achieves wear-leveling of PCM cells inside PCM devices. Besides, we also take remapping overhead into consideration. The experiments were conducted based on the representative realistic workloads, and the results demonstrate the efficacy of the proposed scheme.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信