{"title":"用于无线千兆收发器应用的60 ghz频段LTCC模块技术","authors":"K. Maruhashi, M. Ito, S. Kishimoto, K. Ohata","doi":"10.1109/RFIT.2005.1598892","DOIUrl":null,"url":null,"abstract":"This paper presents 60-GHz-band module technology for gigabit wireless systems. All millimeter-wave components described here are flip-chip mountable devices, providing highly repeatable interconnects even for such a high-frequency range. For multi-chip modules, multi-layer LTCC substrates with cavity structures are employed, where MMICs, filters and dielectric resonator oscillators are mounted. Once the module fabrication is completed, only DC feeding and baseband I/O should be cared to connect with printed wiring boards. For 60-GHz-band ASK modules, modulation/demodulation with a speed more than 1 Gb/s and an output power of 10 mW are achieved. The modules are implemented in several applications. The uncompressed high-definition video transmission systems are highlighted.","PeriodicalId":337918,"journal":{"name":"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":"{\"title\":\"60-GHz-band LTCC module technology for wireless gigabit transceiver applications\",\"authors\":\"K. Maruhashi, M. Ito, S. Kishimoto, K. Ohata\",\"doi\":\"10.1109/RFIT.2005.1598892\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents 60-GHz-band module technology for gigabit wireless systems. All millimeter-wave components described here are flip-chip mountable devices, providing highly repeatable interconnects even for such a high-frequency range. For multi-chip modules, multi-layer LTCC substrates with cavity structures are employed, where MMICs, filters and dielectric resonator oscillators are mounted. Once the module fabrication is completed, only DC feeding and baseband I/O should be cared to connect with printed wiring boards. For 60-GHz-band ASK modules, modulation/demodulation with a speed more than 1 Gb/s and an output power of 10 mW are achieved. The modules are implemented in several applications. The uncompressed high-definition video transmission systems are highlighted.\",\"PeriodicalId\":337918,\"journal\":{\"name\":\"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"17\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RFIT.2005.1598892\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIT.2005.1598892","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
60-GHz-band LTCC module technology for wireless gigabit transceiver applications
This paper presents 60-GHz-band module technology for gigabit wireless systems. All millimeter-wave components described here are flip-chip mountable devices, providing highly repeatable interconnects even for such a high-frequency range. For multi-chip modules, multi-layer LTCC substrates with cavity structures are employed, where MMICs, filters and dielectric resonator oscillators are mounted. Once the module fabrication is completed, only DC feeding and baseband I/O should be cared to connect with printed wiring boards. For 60-GHz-band ASK modules, modulation/demodulation with a speed more than 1 Gb/s and an output power of 10 mW are achieved. The modules are implemented in several applications. The uncompressed high-definition video transmission systems are highlighted.