热应力对柔性基板全印刷过孔可靠性的影响

Udara S. Somarathna, M. Alhendi, B. Garakani, M. Poliks, D. Weerawarne, J. Iannotti, C. Kapusta, N. Stoffel, S. G. Gonya
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引用次数: 0

摘要

柔性聚合物基板上的全印刷过孔的可靠性对于柔性混合电子器件(FHE)的正常功能至关重要,这涉及到相互连接的多层电子电路。现有文献主要集中在通过丝网印刷和喷墨印刷技术制造的柔性聚合物基材上的全印刷过孔的机械可靠性。因此,在这项工作中,我们为热冲击下全印刷通孔的可靠性提供了新的实验证据。本文讨论了该材料的制作工艺、光学特性和热冲击测试等细节。采用两种不同的工艺流程制备了全印刷部分填充盲孔和涂壁通孔。在3-mil聚酰亚胺基板上激光钻孔直径为50 ~ 300 μm的孔,并采用丝网印刷和气溶胶喷射印刷技术,使用三种不同粘度的微粒和纳米颗粒基导电油墨进行印刷。基于层间电连通性和反复热冲击循环后电阻的变化,评估了全印刷过孔的性能。实验结果表明,在-55 ~ 125℃的温度范围内,全印刷过孔在热冲击下具有良好的稳定性和可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Effect of Thermal Stress on the Reliability of all-Printed Vias on Flexible Substrates
Reliability of all-printed vias fabricated on flexible polymer substrates is crucial for the proper functionality of flexible hybrid electronics (FHE) which involve interconnected multilayer electronic circuitry. Existing literature primarily focuses on the mechanical reliability of all-printed vias on flexible polymer substrates fabricated by screen printing and inkjet printing techniques. Therefore, in this work, we present new experimental evidence on the reliability of all-printed vias under thermal shock. The details of the fabrication process, optical characterization, and thermal shock testing are discussed in this paper. Two different fabrication process flows were adopted to obtain all-printed partially-filled blind vias and wall-coated through-hole vias. Vias of 50 - 300 μm diameter were laser drilled on a 3-mil polyimide substrate and printed by screen printing and aerosol-jet printing techniques using three types of microparticle- and nanoparticle-based conductive inks of different viscosities. The performance of the all-printed vias was evaluated based on the interlayer electrical connectivity and the change in electrical resistance after exposure to repeated thermal shock cycles. The experimental results show that the all-printed vias are robust and reliable under thermal shock in the temperature (°C) range of -55 to 125.
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