{"title":"eWLP的装配可靠性,模具和模具尺寸BGA","authors":"R. Ghaffarian","doi":"10.1109/iTherm54085.2022.9899504","DOIUrl":null,"url":null,"abstract":"This paper presents assembly challenges as well as solder joint thermal-cycle reliability of mixed area array packaging and flip-chip die technologies. These were: (1) eWLP-LGA, 196 land patterns, 0.4mm pitch, (2) Cu-FC (CC80), flip-chip die with copper pillar, 1048 bumps, and (3) CVBGA, 360 balls, 0.4mm pitch and with either lead-free or tin-lead solder balls.Twenty-seven (27) PCBs were assembled with a number of variables and rejected assemblies. Acceptable assemblies with and without underfill were subjected to thermal cycling between –40°C and 125°C for solder-joint reliability characterization and failure-mechanism assessments. The 2-parameter Weibull plots delineated cumulative failures and optical X-sectional characterization presented failure mechanisms and locations.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Assembly Reliability of eWLP, Die- and Die-Size BGA\",\"authors\":\"R. Ghaffarian\",\"doi\":\"10.1109/iTherm54085.2022.9899504\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents assembly challenges as well as solder joint thermal-cycle reliability of mixed area array packaging and flip-chip die technologies. These were: (1) eWLP-LGA, 196 land patterns, 0.4mm pitch, (2) Cu-FC (CC80), flip-chip die with copper pillar, 1048 bumps, and (3) CVBGA, 360 balls, 0.4mm pitch and with either lead-free or tin-lead solder balls.Twenty-seven (27) PCBs were assembled with a number of variables and rejected assemblies. Acceptable assemblies with and without underfill were subjected to thermal cycling between –40°C and 125°C for solder-joint reliability characterization and failure-mechanism assessments. The 2-parameter Weibull plots delineated cumulative failures and optical X-sectional characterization presented failure mechanisms and locations.\",\"PeriodicalId\":351706,\"journal\":{\"name\":\"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)\",\"volume\":\"53 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/iTherm54085.2022.9899504\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/iTherm54085.2022.9899504","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Assembly Reliability of eWLP, Die- and Die-Size BGA
This paper presents assembly challenges as well as solder joint thermal-cycle reliability of mixed area array packaging and flip-chip die technologies. These were: (1) eWLP-LGA, 196 land patterns, 0.4mm pitch, (2) Cu-FC (CC80), flip-chip die with copper pillar, 1048 bumps, and (3) CVBGA, 360 balls, 0.4mm pitch and with either lead-free or tin-lead solder balls.Twenty-seven (27) PCBs were assembled with a number of variables and rejected assemblies. Acceptable assemblies with and without underfill were subjected to thermal cycling between –40°C and 125°C for solder-joint reliability characterization and failure-mechanism assessments. The 2-parameter Weibull plots delineated cumulative failures and optical X-sectional characterization presented failure mechanisms and locations.