离散集成电路电子学(DICE)

2020 IEEE High Performance Extreme Computing Conference (HPEC) Pub Date : 2020-09-22 DOI:10.1109/HPEC43674.2020.9286236

Zach Fredin, J. Zemánek, Camron Blackburn, Erik Strand, A. Abdel-Rahman, Premila Rowles, N. Gershenfeld

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引用次数: 1

摘要

我们介绍DICE(离散集成电路电子)。DICE不是单独开发芯片、封装、电路板、刀片和系统，而是通过计算构建块的三维组装在直接写入过程中跨越这些尺度。我们介绍了DICE部件，讨论了它们的组装、编程和设计工作流，说明了在机器学习和高性能计算以及项目性能方面的应用。

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Discrete Integrated Circuit Electronics (DICE)

We introduce DICE (Discrete Integrated Circuit Electronics). Rather than separately develop chips, packages, boards, blades, and systems, DICE spans these scales in a direct-write process with the three-dimensional assembly of computational building blocks. We present DICE parts, discuss their assembly, programming, and design workflow, illustrate applications in machine learning and high performance computing, and project performance.

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2020 IEEE High Performance Extreme Computing Conference (HPEC)

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