基于物理器件模拟的场极板对GaN/AlGaN/GaN HEMT低动态Ron的研究

A. Hemanth, Manoj Kumar Reddy, Jhansi Lakshmi, B. H. Kumar, Lavanya Bandi, G. Sheu, Yu-Lin Song, Po-An Chen, Luh-Maan Chang
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引用次数: 4

摘要

本文研究了以亚硝酸盐镓帽接触方案和层间介质(ILD)为氮化物的场极板结构对GaN/AlGaN/GaN高电子迁移率晶体管(HEMT)性能的影响。我们在热点区域的电场峰值处展示了显著的结果。这说明电场板可以抑制栅极向漏极边缘处的电场峰值。其主要优点是击穿电压的上升和低电场峰值场。这些Synopsys Technology计算机辅助设计(TCAD)模拟结果清楚地表明,除了场板设计外,介质材料厚度对获得低动态Ron比也起着至关重要的作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigations of Low Dynamic Ron on GaN/AlGaN/GaN HEMT by Field Plate Using Physical Device Simulations
This study examines the effects of field plate structure with gallium nitrite cap contact scheme and inter layer dielectric (ILD) as nitride on the performance of GaN/AlGaN/GaN High electron mobility transistor (HEMT). We have exhibited the prominent results at the peak of electric field happened on the hot spot region. This indicates that the field plate can help to suppress the peak of electric field at the verge of the gate towards drain. The key advantage is rise of the breakdown voltage with low electric peak field. These Synopsys Technology Computer Aided Design (TCAD) simulated results clearly show that besides field plate design dielectric material thickness also plays a vital role to obtain low dynamic Ron ratio.
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