通过经济高效和可扩展的封装实现大规模部署光子学

2015 IEEE 12th International Conference on Group IV Photonics (GFP) Pub Date : 2015-10-26 DOI:10.1109/GROUP4.2015.7305910

T. Barwicz, Y. Taira, Ted W. Lichoulas, N. Boyer, H. Numata, Y. Martin, J. Nah, S. Takenobu, Alexander Janta-Polczynski, E. Kimbrell, R. Leidy, M. Khater, S. Kamlapurkar, S. Engelmann, Y. Vlasov, P. Fortier

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引用次数: 13

摘要

在高通量微电子设备中实现单模光子封装可以显著提高成本和可扩展性。我们用12光纤接口和倒装芯片激光器实验证明了这种解决方案。我们测量的光纤到芯片传输峰值为-1.3dB。

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Enabling large-scale deployment of photonics through cost-efficient and scalable packaging

Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure -1.3dB peak fiber-to-chip transmission.

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2015 IEEE 12th International Conference on Group IV Photonics (GFP)

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