各向同性导电胶互连技术在电子封装中的应用

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI:10.1002/9781118831373.CH5

J. Morris, Jeahuck Lee, J. Liu

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引用次数: 10

摘要

本文旨在为进入各向同性导电胶粘剂(ICA)领域的研究人员和实践者提供初步资源，但也可能证明对那些有先前经验的人有用。它提出了在ICA的发展和在各种电子封装应用中代替焊接技术的使用所面临的问题的历史概述。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications

This paper is intended to provide an initial resource for researchers and practitioners entering the isotropic conductive adhesive (ICA) field, but may also prove useful to those with prior experience. It presents an historical overview of the issues confronted in ICA development and use in various electronics packaging applications in place of soldering technology.

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Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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