利用无掩模光刻技术提高电子传感器的性能

A. Nag, A. I. Zia, S. Mukhopadhyay, J. Kosel
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引用次数: 9

摘要

小型化传感器的应用不断升级,使得微电子工业与精密微制造技术并驾齐驱。下面的文章描述了一种制造具有高灵敏度和实时检测能力的微型交叉数字电容传感器的新技术。在标准的光刻工艺中,传感器是用不同的光刻胶材料制造的,这使得制造的产品具有不同的特性。单晶掺磷硅片由于其优于锗的特性而被用作衬底材料。采用海德堡系统在硅衬底上对新型数字间传感器进行无掩模光刻。该过程在没有紫外线的洁净室中在固定温度下进行。所制备的传感器用于可燃气体的传感应用。利用电化学阻抗谱法对传感器测得的电阻阻抗和电容阻抗进行了读取。结果表明,与商用传感器相比,该传感器在LPG检测方面具有更好的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance enhancement of electronic sensor through mask-less lithography
The escalating applications of miniaturized sensors have led the microelectronics industry to stay abreast with the precise micro-fabrication technologies. The following article describes a new technique for the fabrication of miniaturized interdigitated capacitive sensors that own highly sensitive and real-time detections capabilities. In standard lithographic procedure, the sensors are fabricated applying different photoresist materials that give rise to the variable characteristic profile of the fabricated product. Single crystal p-doped Silicon wafer was used as a substrate material due to its advantageous properties over Germanium. Heidelberg system was used for the maskless lithographic patterning of the new interdigital sensors on a silicon substrate. The process was carried out in a clean room in the absence of ultraviolet light at a fixed temperature. The fabricated sensors were used for inflammable gas sensing application. Electrochemical Impedance Spectroscopy was applied to read the resistive and capacitive impedance measured by the sensor. The results proclaimed that the fabricated sensors own better performance in LPG detection as compared to its commercial counterparts.
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