毫米波无源电路的建模与设计:从2到3D

1994 24th European Microwave Conference Pub Date : 1994-10-01 DOI:10.1109/EUMA.1994.337197

R. Sorrentino

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引用次数: 6

摘要

随着微波和毫米波电路技术的进步，全波电磁方法已经成为模拟依赖于复杂三维电路结构(多层电路、垂直集成、多芯片模块、有限金属厚度等)的许多现象(邻近效应、封装相互作用、串扰等)的必要方法。本文解决了一些问题，并回顾了与现代微波电路的建模和优化有关的最新进展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Modelling and Design of Millimetrewave Passive Circuits: from 2 to 3D

With the advances of microwave and millimetrewave circuit technology, fullwave electromagnetic approach has become necessary to model a number of phenomena (proximity effects, package interaction, crosstalk, etc.) dependent on complicated 3-D circuit configurations (multilevel circuits, vertical integration, multichip modules, finite metal thickness, etc.). This paper addresses a number of issues and reviews recent advances relevant to the modelling and optimisation of modern microwave circuits.

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来源期刊

1994 24th European Microwave Conference

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