在Ta和Nb表面形成硅化物薄膜

E. Afanas’eva, S. M. Solov'ev
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引用次数: 0

摘要

在Nb和Ta表面生长硅化物薄膜的机理与衬底温度有关。室温下,Si在Ta和Nb上逐层生长。Si在Ta和Nb上的表面密度为9.3.10/sup 14/ at/cm/sup 2/。在温度>900 K时,Si开始渗入Nb和Ta。在此温度下形成NbSi/sub - 2/和TaSi/sub - 2/组合物。当温度T>1360 K (Ta)和T>1270 K (Nb)时发生结构相变,在地下区域达到一定临界Si浓度后形成硅化物Ta/sub - 4/Si和Nb/sub - 4/Si。相变发生后,Si原子从表面向体体扩散增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Formation of thin silicide films on Ta and Nb surfaces
The mechanism of thin silicide film growth on Nb and Ta surfaces depended on the substrate temperature. At room temperature the layer-by-layer growth of Si on Ta and Nb took place. The surface density of Si in one monolayer was 9.3.10/sup 14/ at/cm/sup 2/ on Ta and Nb. The onset of the penetration Si into Nb and Ta was observed at T>900 K. At this temperature the composition NbSi/sub 2/ and TaSi/sub 2/ were formed. At temperature T>1360 K for Ta and T>1270 K for Nb a structural phase transition occurred and silicide Ta/sub 4/Si and Nb/sub 4/Si was formed after reaching a certain critical concentration of Si in the subsurface region. Phase transition was followed by increase of the Si atoms diffusion from the surface into the bulk.
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