用于微纳米连接的高熵合金

Ashutosh Sharma
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引用次数: 7

摘要

本章的目的是为金属陶瓷接头和高熵合金(HEA)在微连接中的应用研究提供一个基本的认识。我们将首先概述金属陶瓷钎焊中的问题以及使用各种填料克服这些问题的解决方案。将陶瓷与金属材料连接的方法有很多种。一种方法是寻找具有所谓的高熵特性的钎焊合金,它表现为固溶体。将研究传统的合金设计和电弧熔化、Bridgman凝固以及先进的粉末冶金技术,包括用于机械合金化过程的高能球磨(HEBM),以及用于改进致密化和相变的热压和火花等离子烧结(SPS)技术。我们还总结了获得高熵相的各种热力学关系,并在本章后期提出了高熵合金在微连接研究中的未来可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-Entropy Alloys for Micro- and Nanojoining Applications
The aim of this chapter is to provide a basic understanding of the metal-ceramic joints and high-entropy alloy (HEA) research in microjoining applications. We will first overview the issues in metal-ceramic brazing and solutions to overcome those issues using various fillers. Various approaches are available for joining ceramic to metallic materials. One approach will be to look for brazing alloys with the so-called high-entropy characteristics which exhibit a solid solution phase. The conventional alloy design and arc melting, Bridgman solidification, and advanced powder metallurgy techniques will be studied, including high-energy ball milling (HEBM) for the mechanical alloying process, and hot-press and spark plasma sintering (SPS) techniques are utilized for improved densification and phase transformation. We also summarize the various thermodynamic relations to obtain the high-entropy phase and present future possibilities of high-entropy alloys in microjoining research at the later stage of this chapter.
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