{"title":"用于数字无绳电话的带有1.9GHz上转换器的硅单片中频收发器","authors":"Arai, Otaka, Fujimoto, Uchida, Terada, Tanaka, Iino, Amano, Shimizu, Hayashihara","doi":"10.1109/ICCE.1997.625965","DOIUrl":null,"url":null,"abstract":"A silicon single-chip IF transceiver with a 1.9-GHz upconverter and L-C IF filter for digital cordless phones, such as Personal Handy-phone System (PHS) of Japan, has been developed. The transceiver chip is mounted in a plastic package (SSOP-24) and is designed in consideration of the parasitic components of bonding wires and lead-pins.","PeriodicalId":127085,"journal":{"name":"1997 International Conference on Consumer Electronics","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Silicon Single-chip IF Transceiver With A 1.9GHz Up-converter For Digital Cordless Phones\",\"authors\":\"Arai, Otaka, Fujimoto, Uchida, Terada, Tanaka, Iino, Amano, Shimizu, Hayashihara\",\"doi\":\"10.1109/ICCE.1997.625965\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A silicon single-chip IF transceiver with a 1.9-GHz upconverter and L-C IF filter for digital cordless phones, such as Personal Handy-phone System (PHS) of Japan, has been developed. The transceiver chip is mounted in a plastic package (SSOP-24) and is designed in consideration of the parasitic components of bonding wires and lead-pins.\",\"PeriodicalId\":127085,\"journal\":{\"name\":\"1997 International Conference on Consumer Electronics\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-06-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 International Conference on Consumer Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCE.1997.625965\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 International Conference on Consumer Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCE.1997.625965","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Silicon Single-chip IF Transceiver With A 1.9GHz Up-converter For Digital Cordless Phones
A silicon single-chip IF transceiver with a 1.9-GHz upconverter and L-C IF filter for digital cordless phones, such as Personal Handy-phone System (PHS) of Japan, has been developed. The transceiver chip is mounted in a plastic package (SSOP-24) and is designed in consideration of the parasitic components of bonding wires and lead-pins.