光线追踪法分析和量化透明材料表面缺陷周围的光增强

Photonics Asia Pub Date : 2014-12-10 DOI:10.1117/12.2074559
Rong Wu, Dongfeng Zhao, Lei Zhang, Ping Shao, N. Hua, Zunqi Lin
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引用次数: 1

摘要

光学玻璃的激光损伤已成为大功率激光系统中一个日益突出的问题。众所周知,玻璃损坏的主要原因是由于材料中的缺陷和杂质。在实际系统运行中,由地下缺陷(ssd)引起的损坏尤为常见。因此,在存在固态硬盘的情况下,我们开发了一种简单的替代计算方法来评估入射和出口表面周围的光场增强。这种基于经典光学理论的光线追迹方法,能够直观、清晰地显示光强增强的光学现象。对固态硬盘的基本形状进行了研究,揭示了在磨削抛光过程中控制固态硬盘尺寸和密度的重要性和边界条件。最后,为了获得最佳的宽深比,研究了氢氟酸的最小蚀刻量。理论分析和仿真结果提供了一个合适的去除量范围,这在HF蚀刻过程中非常重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ray-tracing method to analyze and quantify the light enhancement around subsurface defects in transparent materials
Laser-induced damage (LID) to optical glass has become a growing problem in high-power laser systems. It is well known that the main reason of glass being damaged is due to defects and impurities in the material. Damage caused by subsurface defects (SSDs) is especially common in actual system running. Accordingly, in the presence of SSDs, a simple and alternative calculation method is developed to evaluate the enhancement of light field around the incident and exit surface. This ray tracing approach, based on the classical optics theory, is very direct and clear to show the optical phenomena of light intensity enhancement. Some basic SSD shapes have been studied and investigated here, which reveals the importance and boundary condition of controlling the size and density of SSDs in grinding and polishing process. Finally, to achieve optimal breadth depth ratio, the least etching amounts by hydrofluoric (HF) acid is investigated. The theoretical analysis and simulation results provide an appropriate range of removal amounts, which is very important in the HF etching process.
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