用于微波子系统的硅对硅集成光学接口

M. Murphy, C.R. Rescod
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引用次数: 1

摘要

本文所述的集成光接口是在使用合适的设备时,在单根光纤上提供宽带模拟信道和双向数字信号分配的能力。基于该技术的应用范围可以是设备间机架互连,跨站点链接或相控阵天线射频和控制/接收数据信号分发。本文具体报道了后一种应用,并为相控阵天线信号分配网络开发了集成光接口。该紧凑型器件用于安装在子阵列级或位于阵列表面的固态发射/接收(T/R)模块内,这种光学技术提供的尺寸优势在这种情况下特别相关。相控阵天线通常需要10到1000个T/R模块,并且潜在的低成本和高性能的光接口非常有吸引力。在操作中,集成光接口将通过光纤分配器网络将微波参考和控制信号路由到收发模块。在相反方向上,将各个数字化接收信道分配回数字波束形成网络以进行适当的信号处理。用于制造这种集成光学接口的技术是基于硅对硅的,所开发的设备具有许多光学和电子功能。这包括波分复用和热光调谐能力,以及数字和射频组件集成。本文报告了如何将这些集成到集成光学接口中,并对制造细节进行了一般描述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A silica-on-silicon integrated optic interface for microwave sub-systems
The integrated optic interface reported in this paper is designed to provide the capability of wideband analogue channel and bidirectional digital signal distribution over a single optical fibre when operated with suitable equipment. The range of applications based on this technology could be for inter-equipment rack interconnection, cross site links or phased array antenna RF and control/receive data signal distribution. It is the latter application that is specifically reported in this paper and the integrated optic interface has been developed for a phased array antenna signal distribution network. The compact device is for mounting at the sub-array level or within the solid state transmit/receive (T/R) modules located at the array face and the size advantages offered by this optical technology are particularly relevant in this case. Phased array antennas may require typically 10 to many 1000s of T/R modules and the potential low cost and high performance of an optical interface is extremely attractive. In operation the integrated optic interface would route a microwave reference and control signal to the T/R module via an optical fibre splitter network. In the reverse direction the individual digitised receive channels are distributed back to the digital beam forming network for appropriate signal processing. The technology used for the manufacture of this integrated optic interface is silica-on-silicon based and the device developed has a number of optical and electronic functions. This includes WDM and thermo-optic tuning capability as well as digital and RF component integration. How these are incorporated into the integrated optic interface with a general description of the manufacturing details are reported in this paper.
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