{"title":"AA 6061T6板材多道次GTA焊接热场及残余应力的实验研究与数值分析","authors":"Narender Kumar, H. Chelladurai","doi":"10.1007/978-981-32-9487-5_17","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":152843,"journal":{"name":"Advances in Simulation, Product Design and Development","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Experimental Investigation and Numerical Analysis of Thermal Fields and Residual Stresses in Multi-pass GTA Welding of AA 6061T6 Plates\",\"authors\":\"Narender Kumar, H. Chelladurai\",\"doi\":\"10.1007/978-981-32-9487-5_17\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":152843,\"journal\":{\"name\":\"Advances in Simulation, Product Design and Development\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advances in Simulation, Product Design and Development\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1007/978-981-32-9487-5_17\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in Simulation, Product Design and Development","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-981-32-9487-5_17","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}