回流焊工艺对SnBi/Cu界面IMC形成的影响

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887582

M. Hirman, K. Rendl, F. Steiner, V. Wirth

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引用次数: 13

摘要

本文研究了在57.6% Bi-42% Sn-0.4% Ag的钎料组成中，钎料形状对金属间层形成的影响。将1206尺寸的片式电阻器用不同的回流焊型进行焊接。PCB上的焊盘由铜制成，因此它们主要制造Cu6Sn5 IMC。这一层对焊接接头的机械强度有影响。采用抗剪强度试验对试样进行了测定。用共聚焦激光扫描显微镜测量了内嵌层厚度。在焊接过程中，IMC层的厚度随着传递到接头的能量的增加而增加。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Influence of reflow soldering profiles on creation of IMC at the interface of SnBi/Cu

The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu6Sn5 IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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