超大规模集成电路标准单元设计的拥塞驱动布局

S. Areibi, Zhen Yang
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引用次数: 2

摘要

亚微米状态使得互连延迟成为决定电路性能的关键因素。因此,电路布局开始在当今的高性能芯片设计中发挥重要作用。除了带宽优化之外,如何减少局部区域的过度拥塞,使路由器能够顺利完成路由也成为另一个重要问题。本文实现了一种后处理减少拥塞的技术,并将其融入到平面分层布局中。结果表明,拥塞驱动的布局方法在带宽略有增加的情况下,将平面设计的拥塞减少了51%,分层设计的拥塞减少了37%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Congestion driven placement for VLSI standard cell design
The sub-micron regime has caused the interconnect delay to become a critical determiner of circuit performance. As a result, circuit placement is starting to play an important role in today's high performance chip designs. In addition to wirelength optimization, the issue of reducing excessive congestion in local regions such that the router can finish the routing successfully is becoming another important problem. In this paper, a post-processing congestion reduction technique is implemented and incorporated into the flat and hierarchical placement. Results obtained show that the congestion-driven placement approach reduces the congestion by about 51% for flat designs and 37% for hierarchical designs with a slight increase in wirelength.
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